Special Session 6

Yang Liu, Yangzhou University
刘洋，扬州大学

Jiajie Fan, Fudan University
樊嘉杰，复旦大学

Prof. Liu's main research area is power electronics packaging and application. As the principal investigator of a collaborating unit, he has led one key project funded by the National Natural Science Foundation of China (NSFC); and as the project leader, he has led several projects including NSFC Youth Projects and China Postdoctoral Science Foundation General Projects. He has published over 100 academic papers, been granted over 10 invention patents, and his research achievements have won numerous awards, including the Second Prize of Heilongjiang Provincial Natural Science Award, the Second Prize of Natural Science Award from the Chinese Society for Stereology, the First Prize of Natural Science Award from Heilongjiang Provincial Higher Education Institutions, and the Harbin Youth Science and Technology Award.

Prof. Jiajie Fan received the Ph.D. degree in industrial and systems engineering at the Hong Kong Polytechnic University, Hung Hom, Hong Kong, China, in 2014. Now, he is a Youth Researcher at Shanghai Engineering Technology Research Center of SiC Power Device, College of Intelligent Robotics and Advanced Manufacturing, Fudan University, Shanghai, China and Guest professor at Department of Microelectronics Engineering, Delft University of Technology, Delft, NL. He is an IEEE Senior Member, Associate Editor of IEEE Access journal. His main research interests include prognostics and health management and wide bandgap power electronics packaging and reliability modeling.

Yang Liu, Harbin University of Science and Technology
刘洋，哈尔滨理工大学

Shuye Zhang, Harbin Institute of Technology
张墅野，哈尔滨工业学院

Main research areas:
1. Semiconductor packaging material and process development
2. Precision soldering and micro/nano interconnection
3. Device reliability and failure physics
4. Multiphysics simulation
5. Digital life and health management

Prof. Zhang's main research area is electronic packaging. As the principal investigator, he has led several research projects, including the National Natural Science Foundation of China (NSFC) Young Scientists Fund, NSFC General Program, and sub-projects under the National Key Research and Development Program of China. He has published 150 academic papers, including 120 as first or corresponding author. Among these, 45 are in JCR Q1 Top journals, 10 have an impact factor above 10, and his publications include 1 ESI Hot Paper and 6 ESI Highly Cited Papers. He holds 13 authorized national invention patents. His research achievements have earned him multiple awards, including the 2024 Q2 Wiley China High Contribution Author Award, the 2024 Journal of Materials Science and Technology (IF 11.2) Outstanding Paper Award, and the 2023 Emerald Best Paper Award. He is recognized as a Heilongjiang Provincial Outstanding Young Scholar, a high-level talent of Heilongjiang Province, an IEEE Senior Member, and a specially appointed young scientist at the Academician Mao Ming Workstation.